Oscillator circuit and device

ABSTRACT

In some embodiments, a differential oscillator includes a differential circuit coupled between a first output node and a second output node and a transformer-coupled band-pass filter (BPF). The transformer-coupled BPF is coupled between the first output node and the second output node and includes a coupling device and a transformer. The coupling device is coupled between the first output node and the second output node. The transformer includes a first winding coupled between the first output node and a voltage node and a second winding coupled between the second output node and the voltage node.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a divisional of U.S. patent application Ser. No.16/731,454, filed Dec. 31, 2019, which claims priority of U.S.Provisional Patent Application Ser. No. 62/943,744, filed Dec. 4, 2019,and is a continuation-in-part of U.S. patent application Ser. No.16/432,004, filed Jun. 5, 2019, now U.S. Pat. No. 10,931,230, issuedFeb. 23, 2021, which claims priority of U.S. Provisional PatentApplication Ser. No. 62/691,928, filed Jun. 29, 2018, each of which isincorporated herein by reference in its entirety.

BACKGROUND

Integrated circuits (ICs) sometimes include one or more oscillatorcircuits that generate signals having frequencies ranging from a fewhertz to hundreds of gigahertz (GHz). The frequencies depend on circuitdesign and, in some cases, one or more circuit input signal values. Avoltage controlled oscillator (VCO) is an oscillator with an outputsignal whose output can be varied over a range, which is controlled byan input voltage. The output frequency of the output signal of theoscillator is directly related to the input voltage. By varying theinput voltage, the output frequency of the output signal is adjusted.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A-1B are schematic diagrams of a voltage controlled oscillator(VCO), in accordance with some embodiments.

FIGS. 2A-2B are a schematic diagram and graph of the phase noiseperformance of a VCO, in accordance with some embodiments.

FIG. 3 is a graph of the transmission coefficient of a VCO, inaccordance with some embodiments.

FIG. 4 is a schematic diagram of a transformer of a transformer-coupledbandpass filter (BPF), in accordance with some embodiments.

FIGS. 5A-5B are schematic diagrams of a transformer-coupled BPF, inaccordance with some embodiments.

FIGS. 6A-6B are a schematic diagram of a transformer-coupled BPF and agraph of the isolation of the transformer-coupled BPF, respectively, inaccordance with some embodiments.

FIG. 7 is a schematic diagram of a transformer-coupled BPF, inaccordance with some embodiments.

FIGS. 8A-8B are graphs of the noise suppression of a VCO, in accordancewith some embodiments.

FIGS. 9A-9B are graphs of the measured oscillation frequency and measurephase noise of a VCO, in accordance with some embodiments.

FIG. 10 is a flowchart of a method of generating an oscillation signal,in accordance with one or more embodiments.

FIGS. 11A and 11B are schematic diagrams of VCOs, in accordance withsome embodiments.

FIGS. 12A and 12B are schematic diagrams of a VCO circuit, in accordancewith some embodiments.

FIGS. 13A-13E are schematic diagrams of feedback oscillators, inaccordance with some embodiments.

FIGS. 14A and 14B are schematic diagrams of differential oscillators, inaccordance with some embodiments.

FIGS. 15A-21B are schematic diagrams of transformer-coupled BPFs, inaccordance with some embodiments.

FIG. 22 is a flowchart of a method of generating an oscillation signal,in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components, values, operations, materials,arrangements, or the like, are described below to simplify the presentdisclosure. These are, of course, merely examples and are not intendedto be limiting. Other components, values, operations, materials,arrangements, or the like, are contemplated. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Voltage controlled oscillators (VCOs) are used as part of a phase lockedloop (PLL) to synchronize the VCO frequency to a reference frequency.The quality of the output of a VCO is compromised when short term randomfrequency signal fluctuations, called phase noise, appear at the output.Phase noise introduces second order and third order harmonic spectralcomponents that alter the output of a VCO. For a VCO to be operable withcertain millimeter wave applications (mmWave) (30 GHz-300 GHz), the VCOneeds to control the amount of phase noise that appears at the VCOoutput.

FIG. 1A is a schematic diagram of a VCO 100, in accordance with someembodiments. VCO 100 has two components: a resonator 102 and atransformer-coupled bandpass filter (BPF) 106. The resonator 102 is usedfor frequency detection and replication for the VCO 100. The resonator102 includes two bias-tee (bias-T) circuits 104 and 108 that provide DCvoltage or DC current in order to bias the resonator 102. The bias-Tcircuit 104 includes an inductor L1, a node 114, and a capacitive deviceC1. The inductor L1 is connected to the node 114 at one end and a DCvoltage power source (V_(BUF)) at the other end. The capacitive deviceC1 is connected to the node 114 at one end and a resistor R1 at theother end. The resistor R1 is connected to a reference voltage node,also referred to as a ground source in some embodiments, at the otherend. The bias-T circuit 108 includes an inductor L2, a node 116, and acapacitive device C2. The inductor L2 is connected to the node 116 atone end and a DC voltage power source (V_(BUF)) at the other end. Thecapacitive device C1 is connected to the node 116 at one end and aresistor R2 at the other end. The resistor R2 is connected to the groundsource at the other end. The bias-T circuits 104 and 108 are used toprovide a fixed DC voltage to transistors M3 and M4.

Transistor M3 is connected at a drain terminal to the node 114 and isconnected at a source terminal to the ground source. A gate oftransistor M3 is connected to a node 118. A variable capacitive deviceC6 is connected to the node 118 at one end and to an electrical node 120at the other end. Transistor M4 is connected at a drain terminal to thenode 116 and is connected at a source terminal to the ground source. Thegate of transistor M4 is connected to a node 122. A variable capacitivedevice C3 is connected to the node 122 at one end and to the node 120 atthe other end. The node 120 is connected to a first control voltage\T_(ctrl1).

A drain terminal of transistor M1 is connected to a node 124 and asource terminal is connected to the ground source. A drain terminal oftransistor M2 is connected to a node 126, and a source terminal isconnected to the ground source. A gate of transistor M1 is connected toa node 128, and a gate of transistor M2 is connected to a node 130. Avariable capacitive device C5 is connected to the node 128 at one endand to a node 132 at the other end. A variable capacitive device C4 isconnected to the node 130 at one end and to the node 132 at the otherend. The node 132 is connected to a second control voltage source(\T_(ctrl1)). The transistors M1 and M2 are thereby configured as agrounded pair of transistors.

The transformer-coupled BPF 106 includes a pair of coupled-transformersT1 and T2, and a pair of coupled capacitive devices C_(c1) and C_(c2).Transformer T1 includes a primary winding W1, a secondary winding W2,and a core CR1. The transformer T2 includes a primary winding W4 asecondary winding W3 and a core CR2. The transformer T1 and T2 areconfigured to operate together as a 1:2 transformer in this embodiment,however, in other embodiments the transformers T1 and T2 have differenttransformer implementations depending on power considerations of theVCO. The transformer T1 produces a phase difference of 180 degrees asindicated by the polarity dots 144 for transformer T1 while the phaseproduced by the transformer device T2 is −180 degrees as indicated bythe polarity dots 146. The primary winding W1 is connected to node 134at one end and to a power supply source (VDD) at the other end and theprimary winding W4 is connected to node 136 at one end and to the powersupply source (VDD) at the other end. The capacitive device C_(c1) isconnected between nodes 134 and 136. The secondary winding W2 is coupledto node 138 at one end and to a voltage source (V_(G)), also referred toas input voltage V_(G) in some embodiments, at the other end and thesecondary winding W3 is connected to node 140 at one end and to voltagesource (V_(G)) at the other end. The capacitive device C_(c2) isconnected between nodes 138 and 140. The coupling of the pair of coupledcapacitive devices C_(c1) and C_(c2) with the transformer T1 and T2 forma BPF.

The connection of node 134 to node 124, node 136 to node 130, node 138to node 128, and node 140 to node 126 connects resonator component 102to the transformer-coupled BPF 106.

FIG. 1B is a schematic diagram of a VCO 110, in accordance with anembodiment. VCO 110 comprises the resonator component 102. VCO 110differs from VCO 100 in the configuration of a transformer-coupled BPF112 in connection with VCO 110. The transformer-coupled BPF 112 issimilar to the transformer-coupled BPF 106 except for the connection ofthe pair of coupled capacitive devices C_(c1) and C_(c2). In VCO 110,the capacitive device C_(c1) is connected between node 134 and node 138,and the capacitive device C_(c2) is connected between node 136 and node140. Both ends of the capacitive devices C_(c1) and C_(c2) of VCO 110are connected to the terminals of the same transformers T1 and T2, whichis opposite the connection of the capacitive devices C_(c1) and C_(c2)for VCO 100.

The pair of transistors M1 and M2 are configured to produce negativeresistance to compensate for signal loss from the transformer-coupledBPF 106. The transistors M1 and M2 operate in the saturation region forcurrent stability to reduce 1/f (also known as flicker noise) caused bycharge trapping and releasing in the transistors M1 and M2; however,removing flicker noise does not reduce phase noise. Flicker noise is nota predominant factor at higher frequency ranges, such as 1 GHz orhigher, where phase noise is more predominant. To reduce phase noise,the transformer-coupled BPFs 106 and 112 use the pair of coupledcapacitive devices C_(c1) and C_(c2) to filter and reduce phase noisecontributed by higher harmonics, such as 2f₀, 3f₀, or higher, where f₀is a lower cutoff frequency of the transformer-coupled BPF 106 or 112described herein. The capacitive devices C_(c1) and C_(c2) are eachcoupled to the pair of coupled-transformers T1 and T2 to form thetransformer-coupled BPF 106 or 112. The frequency response of thetransformer-coupled BPF 106 or 112 includes an additional transmissionzero, defined as the frequency where the frequency response produces anearly zero value. Capacitive devices, such as C_(c1) and C_(c2),increases the number of transmission zeros in a frequency response of asystem due to filtering. The transmission zero for transformer-coupledBPFs 106 or 112 occurs at twice the lower cutoff frequency (2f₀), wherethe lower cutoff frequency (f₀) is the lowest corner frequency of thetransformer-coupled BPF 106 or 112. Moreover, the pair of coupledcapacitive devices C_(c1) and C_(c2) are configured so that thetransformer-coupled BPF includes a bandpass range outside the frequencyrange of the phase noise contributed by the 2^(nd) and 3^(rd) harmonics.In at least some embodiments, the transformer-coupled BPF 106 or 112reduces phase noise by 14 dB or more.

In some embodiments, the transistors M1-M4 are bipolar transistors,field effect transistors (FETs), or the like. In some embodiments, thetransistors M1-M4 are metal-oxide semiconductor field-effect transistors(MOSFETs), such as CMOS, NMOS, PMOS, or the like. In some embodiments,the transistors M1-M4 are different types of transistors. In someembodiments, the ground source described is external to the VCO orinternal ground to the VCO. In some embodiments, the variable capacitivedevices C3-C6 are varactor structures or the like that allow capacitanceto change based on voltage or current.

FIG. 2A is a schematic diagram of a feedback circuit of a VCO 202, inaccordance with an embodiment. The VCO 202 includes a first BPF 204having a gain m₁ that receives as input a signal D1. The first BPF 204produces an output 206 that is a result of the multiplication of thegain m₁ and D1. A second BPF 208, having a gain m₂, receives as input asignal D2. The second BPF 208 produces an output signal 210 that is aresult of the multiplication of a gain m₂ and D2. An adder 212 receivesas input the signal 206 and the signal D2 and outputs a signal G2. Anadder 214 receives as input the signal 210 and the signal D1 and outputsa signal G1. A conductance device 216 receives as input the signal G1,and outputs the signal D1. A conductance device 218 receives as inputthe signal G2, and outputs the signal D2. A feedback arm 220 isconfigured to include the conductance device 216 and adder 214 so thesignal D1 produces consistent results. A feedback arm 222 is configuredto include the conductance device 218 and adder 212 so the signal D2produces consistent results.

In some embodiments, the gains m₁ and m₂ are related to the turn ratiosof each of the transformers of the pair of coupled-transformers asdescribed herein (e.g. “T1” and “T2”). In some embodiments, the gains m₁and m₂ are the same or different. In some embodiments, the conductancedevices 216 and 218 are the conductance of each of the transformers ofthe pair of coupled-transformers T1 and T2 of FIGS. 1A and 1B. In someembodiments, the conductance devices 216 and 218 include circuits thatare external to the VCO 202.

The BPFs 204 and 208 increase the oscillation amplitude by applyinggains m₁ and m₂ to signals D1 and D2 without requiring additional DCvoltage. In this case, the signals D1 and D2 are substantially similarand the gains m₁ and m₂ are 2, and the transformers used by the BPFs 204and 206 have turn ratios of 2. Moreover, all parasitic losses arenegligible. Using these parameters, the signal power of G1 (P_(G1)) isapproximately three times the signal power of D1 (P_(D1)) based on thefeedback circuit of the VCO 202 and the following equation:

P _(D1) +m ₂ P _(D2) =P _(G1)

-   -   If P_(D1)=P_(D2) and m₁=m₂=2    -   P_(G1)=3P_(D1).

The noise power does not increase due to the phase noise suppression ofthe BPFs 204 and 208. The VCO 202 produces a phase reduction ofapproximately 10 log(⅓)≈−4.8 dB.

In some embodiments, the turn ratio is higher than 2 and signals D1 andD2 are not similar.

FIG. 2B is a graph of the phase noise performance 224 of the VCO 202, inaccordance with some embodiments. Plot 224 is a graph of the phase noiseimprovement in decibels (dB) versus turn ratio. As the turn ratioincreases, phase noise improvement increases, i.e., dB levels fall, asdepicted in plot 224.

FIG. 3 is a graph 300 of the transmission coefficient of a VCO, inaccordance with some embodiments. The transmission coefficient of theVCO indicates the amplitude and power outputted by the VCO. The plot 300includes a curve 302 and a curve 304. The curve 302 includes thetransmission coefficient versus frequency of a pair ofcoupled-transformers according to an approach not having atransformer-coupled BPF as described herein, and the curve 304 includesthe transmission coefficient versus frequency of a transformer-coupledBPF (e.g. “106” or “112”) of FIG. 1A or 1B. In this case, thetransformer-coupled BPF has a lower cutoff frequency (f₀) ofapproximately 28 GHz. The curve 304 includes a transmission zero atapproximately 56 GHz or (2f₀) with more than a 14 dB drop relative tothe curve 302 at the same point. At 84 GHz, the curve 304 includes adrop of approximately 14 dB relative to the curve 302. The pair ofcoupled capacitors filters out the higher frequency components of thephase noise.

FIG. 4 is a schematic diagram of a pair of coupled-transformers 400 usedin a transformer-coupled BPF, in accordance with some embodiments. Thepair of coupled-transformers 400 is configured in a two stacked metallayer arrangement. The pair of coupled-transformers includes a number ofconductive structures 406, 412, and 414 formed on a metal layer. Also,the pair of coupled-transformers 400 include a conductive structure 418formed on the metal layer having a first terminal 434 at one end of thecoupled-transformer 400 where two extending portions 438 extend from thefirst terminal 434 to two terminals 422 and 426 at the opposite end. Theextending portions 438 are configured to be the primary windings W1 andW4 shown in FIGS. 1A-1B.

The conductive structure 412 includes a terminal 424 at one end and twooppositely extending portions 436 at the opposite end of the conductivestructure 412. The two oppositely extending portions 436 extend from theterminal 424. The conductive structure 406 includes a first end that isconnected to one of the extending portions 436 near the first terminal434. The conductive structure 406 includes a terminal 420 positioned atan opposite end from the first end. The conductive structure 414includes a first end that is connected to another of the extendingportions 436 of the conductive structure 412 near the first terminal434. Also, the conductive structure 414 includes a terminal 428positioned at an opposite end from the first end. Conductive structures406 and 414 connect with the extending portions 436 of the conductivestructure 412 below the first terminal 434.

Via structures 430 and 432 are configured to provide the connectionsnecessary to form the pair of coupled-transformers 400. A portion of theconductive structures 406, 412, 414, and 418 are positioned above afirst substrate 404. The via structures 432 are configured to makeconnections between the conductive structures 406 and 412 to form thesecondary winding W2 of FIGS. 1A-1B and between conductive structures412 and 414 to form the secondary winding W3 of FIGS. 1A-1B. Theconnection between the conductive structure 406 and the conductivestructure 412 and between the conductive structure 414 and theconductive structure 412 is beneath the first terminal. The otherportions of the conductive structures 406, 412, 414 and 418 include theterminals 420, 422, 424, 426, and 428 are each positioned above one of aseries of second substrate structures 416. The second substratestructures 416 are individually patterned to have similar dimensionswith terminals 420, 422, 424, 426, and 428. Moreover, the via structures430 are configured to make connections between the terminals 420 and 424and between the terminals 424 and 428.

In some embodiments, the first substrate 404 and second substrate 416are separate substrates. In some embodiments, the first substrate 404and second substrates 416 form a single substrate structure. In someembodiments, the first substrate 404 is a silicon (Si) substrate or ametal substrate. In some embodiments, the second substrate 416 is a Sisubstrate or a metal substrate.

In some embodiments, the via structures 430 and 432 are square vias. Insome embodiments, the via structures 430 and 432 have octagonal shapes,hexagonal shapes, rectangular shapes, or the like. In some embodiments,the via structures 430 and 432 are through silicon vias. In someembodiments, the via structures 430 and 432 are holes etched in aninterlayer dielectric that is filled with a metal. In some embodiments,the via structures 430 and 432 are buried vias. In some embodiments, thevia structure 430 is different from via structure 432. In someembodiments, the via structures 430 and/or 432 are replaced with layeredmetal pairs to form interconnections with the conductive structures 406,412, 414, and 418.

FIG. 5A is a schematic diagram of a transformer-coupled BPF 500, inaccordance with some embodiments. The transformer-coupled BPF 500includes a pair of coupled-transformers that is similar to the pair ofcoupled-transformers 400 of FIG. 4. Moreover, FIG. 5A includes the samecoupling arrangement of the pair of coupled capacitive devices C_(c1)and C_(c2) as in FIG. 1A of the transformer-coupled BPF 106. The firstterminal 434 is coupled to the voltage source V_(DD) and the inputvoltage (V_(G)) is connected to terminal 424. The coupled capacitivedevice C_(c1) is connected at one end to terminal 420 and the other endis connected to terminal 426. The coupled capacitive device C_(c2) isconnected at one end to terminal 422 and the other end is connected toterminal 428. The transformer-coupled BPF 500 is an embodiment of thetransformer-coupled BPF 106 of FIG. 1A.

FIG. 5B is a schematic diagram of a transformer-coupled BPF 502, inaccordance with some embodiments. The transformer-coupled BPF 502includes a pair of coupled-transformers that is similar to the pair ofcoupled-transformers 400 of FIG. 4. Moreover, FIG. 5B includes a similarcoupling arrangement as in FIG. 1B of the pair of coupled capacitivedevices C_(c1) and C_(c2) of the transformer-coupled BPF 112. The firstterminal 434 is coupled to the voltage source V_(DD) and the inputvoltage (V_(G)) is connected to terminal 424. The coupled capacitivedevice C_(c1) is connected at one end to terminal 420 and the other endis connected to terminal 422. The coupled capacitive device C_(c2) isconnected at one end to terminal 426 and the other end is connected toterminal 428. The transformer-coupled BPF 502 is an embodiment of thetransformer-coupled BPF 112 of FIG. 1B.

The transformer-coupled BPFs 500 and 502 have similar propertiesdescribed herein for the transformer-coupled BPFs 106 and 112 of FIG. 1Aand FIG. 1B. In particular, the transformer-coupled BPFs 500 and 502have a transmission zero at twice the lower cutoff frequencies (2f₀).Moreover, the transformer-coupled BPFs 500 and 502 filter phase noisecontributed by the 2^(nd) and 3^(rd) harmonics, as described herein.

FIG. 6A is a schematic diagram of a transformer-coupled BPF 600, inaccordance with some embodiments. The transformer-coupled BPF 600 issimilar to the transformer-coupled BPF 502 described in FIG. 5B. FIG. 6Aincludes the terminal 424 being coupled to the lowest metal layer 602,and the pair of capacitive devices C_(c1) and C_(c2) being similarlyarranged as the transformer-coupled BPF 502 of FIG. 5B. The metal layer602 is configured to be coupled to the voltage source (V_(G)). Also, thetransformer-coupled BPF 600 is configured to provide isolation toprevent noise produced by parasitic resistance or the like. The widthratio between the width of the terminals (W₁) and the width of the metallayer 602 (W₂) is correlated to increasing isolation in thetransformer-coupled BPF 600.

FIG. 6B is a graph of the isolation versus width ratio (W₁/W₂). The plot604 includes two curves 606 and 608. The curve 606 includes theisolation versus width ratio for a transformer-coupled BPF operating at28 GHz, and the curve 608 includes the isolation versus width ratio fora transformer-coupled BPF operating at 56 GHz. The higher the widthratio the better the isolation, as shown in both curves 606 and 608. Oneway to increase isolation is to decrease the width (W2) of the metallayer 602. At 28 GHz and 56 GHz, a width ratio of 8 or higher is used.

FIG. 7 is a schematic diagram of a transformer-coupled bandpass filter(BPF) 700, in accordance with some embodiments. The transformer-coupledBPF 700 is similar to the transformer-coupled BPF 600 described in FIG.6A. Also, FIG. 7 includes a pair of coupled capacitive devices C_(c1)and C_(c2) being positioned at a lower metal layer beneath thetransformer-coupled BPF 700 at regions 714 and 716. The placement of thecoupled pair of capacitive devices C_(c1) and C_(c2) at the lower metallayer beneath the transformer allows for sufficient separation betweenthe coupled pair of capacitive devices C_(c1) and C_(c2) and the otheroperational elements of the transformer-coupled BPF 700. The separationlowers the effects of parasitic capacitance introduced by the coupledcapacitive devices C_(c1) and C_(c2) to the remaining operationalelements of the transformer-coupled BPF 700. Moreover, the space area ofthe transformer-coupled BPF 700 is decreased. In some embodiments, alayer of insulator material or the like is used to form the pair ofcoupled capacitive devices underneath the transformer.

FIG. 8A is a graph 800 of the output power of a VCO, in accordance withsome embodiments. In particular, the graph 800 includes the output powerversus frequency at the fundamental frequency and several harmonics of afirst VCO according to another approach not having a transformer-coupledBPF as described herein and a second VCO according to the approach of atransformer-coupled BPF as described herein. The fundamental frequencyis 28 GHz. At the second harmonic (56 GHz), the first VCO produces adrop of 22 dB in phase noise and the second VCO produces a larger dropof 28 dB. At the third harmonic (84 GHz) and fourth harmonic (112 GHz),the second VCO produces larger drops in phase noise relative to thefirst VCO due to filtering properties of the transformer-BPFs asdescribed herein.

FIG. 8B is a graph of the noise suppression of a VCO, in accordance withsome embodiments. In this case, FIG. 8B includes a graph 802 having twocurves 804 and 806. The curve 804 is the simulated phase noise versusoffset frequency of a first VCO according to another approach not havinga transformer-coupled BPF as described herein and curve 806 is thesimulated phase noise versus offset frequency of a second VCO having atransformer-coupled BPF as described herein. The phase noise of thesecond VCO is improved by 6.8 and 4.6 dB at 100 kHz and 1 MHz offset asshown in FIG. 8B.

FIG. 9A is a graph 902 of the measured frequency oscillation. The graph902 includes two curves 904 and 906. The curve 904 includes a simulationof the oscillation frequency versus control voltage (Vctrl2) of a VCOhaving a transformer-coupled BPF as described herein, and the curve 906shows the actual measurement of the oscillation frequency versus controlvoltage (Vctrl2) of the same VCO. The tuning range illustrated in plot902 is between 27.2 GHz and 27.7 GHz. The more the control voltageincreases the smaller the difference between the oscillation frequenciesof the simulation and measurement becomes, as shown in FIG. 9A.

FIG. 9B is a graph 904 of the measured phase noise. The graph 904includes two curves 908 and 910. The curve 908 is the measured phasenoise at 27.4 GHz for a first VCO according to another approach nothaving a transformer-coupled BPF as described herein while curve 910 isthe measured phase noise at 27.4 GHz for a second VCO having atransformer-coupled BPF as described herein. The measured phase noisefor curve 910 is improved by 5 dB compared to the measured phase noisefor curve 908. This improvement is consistent with the 4.8 dB phasenoise reduction discussed in FIGS. 2A-2B.

FIG. 10 is a flowchart of a method 1000 of generating an oscillationsignal, in accordance with one or more embodiments. The method 1000 isusable to generate a low phase noise oscillation signal. In step 1002,an input voltage, such as V_(G) (FIG. 2A), is received at an inputterminal, such as terminal 424 of the pair of coupled-transformer 400,of a transformer-coupled BPF.

In step 1004, a power supply voltage, such as VDD, is received at apower supply input, such as first terminal 434 of the pair ofcoupled-transformer 400, of the transformer-coupled BPF.

In step 1006, the transformer-coupled BPF is coupled with a controlvoltage, such as Vctrl2 or Vctrl1, through a transistor pair, such as M1and M2. In some embodiments, the transformer-coupled BPF includes a pairof coupled-transformers having specific turn ratios. Thetransformer-coupled BPF includes a pair of coupled capacitive devices.In some embodiments, a first capacitive device of the pair of coupledcapacitive devices is coupled at one end to a gate of a first transistorof the pair of transistors and the other end is coupled to a drain of asecond transistor of the pair of transistors, and a second capacitivedevice of the pair of coupled capacitive devices is coupled at one endto the drain of the first transistor of the pair of transistors and theother end is coupled to the gate of the second transistor of the pair oftransistors. In some embodiments, the first capacitive device of thepair of coupled devices is coupled at one end to a gate and the otherend is coupled to a drain of a first transistor of the pair oftransistors, and the second capacitive device of the pair of coupledcapacitive devices is coupled at one end to a gate and the other end iscoupled to a drain of a second transistor of the pair of transistors.

In step 1008, the oscillating signal is produced having a frequency thatcorresponds to a voltage level of the control voltage.

FIGS. 11A and 11B are schematic diagrams of respective VCOs 1100A and1100B, in accordance with some embodiments. VCO 1100A corresponds to VCO100 discussed above with respect to FIG. 1A, and in some embodiments isequivalent to VCO 100, as discussed below. VCO 1100B corresponds to VCO110 discussed above with respect to FIG. 1B, and in some embodiments isequivalent to VCO 110, as discussed below.

Each of VCOs 1100A and 1100B includes power supply source VDD andvoltage source V_(G), each discussed above with respect to VCOs 100 and110 and FIGS. 1A and 1B, a resonator 1102, and, in some embodiments, acapacitive device Cb coupled between power supply source VDD and theground source. VCO 1100A also includes a transformer-coupled BPF 1106,and VCO 1100B also includes a transformer-coupled BPF 1112.

Transformer-coupled BPF 1106 corresponds to transformer-coupled BPF 106discussed above with respect to VCO 100 and FIG. 1A, and in someembodiments is equivalent to transformer-coupled BPF 106, as discussedbelow. Transformer-coupled BPF 1112 corresponds to transformer-coupledBPF 112 discussed above with respect to VCO 110 and FIG. 1B, and in someembodiments is equivalent to transformer-coupled BPF 112, as discussedbelow.

Each of transformer-coupled BPFs 1106 and 1112 includes the circuitelements and configurations of respective transformer-coupled BPFs 106and 112, except that each of transformer-coupled BPFs 1106 and 1112includes coupling devices CD1 and CD2 instead of capacitive devicesC_(c1) and C_(c2).

A coupling device, e.g., coupling device CD1 or CD2, is an IC deviceincluding one or more IC structures configured to provide an impedance,e.g., a capacitive and/or inductive path, between two terminals, e.g.,terminals coupled to nodes 134, 136, 138, and 140 as depicted in FIGS.11A and 11B. In various embodiments, a coupling device includes one ormore of a capacitive device, e.g., a plate capacitor, e.g., ametal-insulator-metal (MIM) capacitor, a capacitor-configured MOSdevice, or an adjustable capacitor, e.g., a MOSCAP, a capacitor network,an LC network, or another IC structure capable of providing the pathimpedance. In various embodiments, a coupling device is one of couplingdevices 1900C-2100C depicted in respective FIGS. 19A-21B and discussedbelow.

In some embodiments, a coupling device is equivalent to a capacitivedevice. In some embodiments, by including a capacitive device and one ormore elements in addition to the capacitive device, a coupling device iscapable of having frequency characteristics different from those of thecapacitive device alone. In various embodiments, a coupling device isthereby capable of having multiple transmission zeroes such that,compared to a circuit including a capacitive device alone, the circuitincluding the coupling device exhibits improved suppression of harmonicsin operation.

In some embodiments, a coupling device is one of capacitive devicesC_(c1) or C_(c2). In some embodiments, one or both oftransformer-coupled BPFs 1106 or 1112 includes capacitive devices C_(c1)and C_(c2) as respective coupling devices CD1 and CD2 and is therebyequivalent to the corresponding one or both of transformer-coupled BPFs106 or 112.

Resonator 1102 includes DC voltage power source V_(BUF), controlvoltages Vctrl1 and Vctrl2, bias-T circuits 104 and 108, transistorsM1-M4, and capacitive devices C3-C6, configured as discussed above withrespect to resonator 102 and FIGS. 1A and 1B. Compared to resonator 102discussed above, resonator 1102 depicted in FIGS. 11A and 11B does notinclude resistors R1 and R2, and instead includes respective inputterminals IN1 and IN2. In some embodiments, resonator 1102 includesresistor R1 (not shown in FIGS. 11A and 11B) coupled between inputterminal IN1 and the ground voltage and resistor R2 (not shown in FIGS.11A and 11B) coupled between input terminal IN2 and the ground voltage,and is thereby equivalent to resonator 102.

In various embodiments, one or both of input terminals IN1 or IN2 iscoupled to one or more circuit elements (not shown) external toresonator 1102 and is thereby configured to control a voltage level atthe respective node 114 or 116 based on DC voltage power source V_(BUF)and the respective one of bias-T circuit 104 or 108. Compared to VCOs100 and 110 including resonator 102 discussed above, VCOs 1100A and1100B including resonator 1102 are thereby configured to have increasedbiasing flexibility, in operation.

Capacitive device Cb is a capacitor, MOSFET, or similar IC devicecoupled between power supply source VDD and the ground voltage.Capacitive device Cb thereby provides a low-resistance path betweenpower supply source VDD and the ground voltage for alternating current(AC) signals in operation, and each of VCOs 1100A and 1100B is therebyconfigured to reduce effects from radio frequency (RF) and/or lowfrequency noise, e.g., possible oscillations in biasing networks.Compared to VCOs 100 and 110, VCOs 1100A and 1100B including capacitivedevice Cb are thereby configured to have increased stability.

By the configurations discussed above, each of VCOs 1100A and 1100B iscapable of realizing the benefits discussed above with respect to VCOs100 and 110 along with increased harmonic suppression, flexibility,and/or stability as discussed above.

In some embodiments, VCO 1100A includes transformer-coupled BPF 1106equivalent to transformer-coupled BPF 106, resonator 1102 equivalent toresonator 102, and does not include capacitive device Cb, e.g.,capacitive device Cb is external to VCO 1100A, and VCO 1100A is therebyequivalent to VCO 100 discussed above with respect to FIG. 1A. In someembodiments, VCO 1100B includes transformer-coupled BPF 1112 equivalentto transformer-coupled BPF 112, resonator 1102 equivalent to resonator102, and does not include capacitive device Cb, e.g., capacitive deviceCb is external to VCO 1100B, and VCO 1100B is thereby equivalent to VCO110 discussed above with respect to FIG. 1B.

Table 1 lists parameters for various known approaches in which a VCOdoes not include a transformer-coupled BPF in comparison with anon-limiting example of VCO 1100A. The first column includes either areference number or the non-limiting example of VCO 1100A, the secondcolumn indicates either a CMOS or SOI technology corresponding to eachapproach. The third through eighth columns indicate a respective powersupply voltage level, carrier frequency, phase noise level at 1megahertz (MHz), power consumption level, phase noise as a figure ofmerit (FoM), and core area corresponding to each approach.

TABLE 1 Phase Noise Power FoM Core Frequency @1-MHz consumption (dBc/area Ref. Technology V_(DD) (V) (GHz) (dBc/Hz) (mW) Hz) (mm²) 1 CMOS 1.228 −112.9 12 −191 0.086 2 CMOS 1.2 20.9 −103.2 7.2 −181 0.088** 3 CMOS1.0 26.4 −106.6 12.7 −184 0.047 4 CMOS 0.9 24.8 −101 13.5 −178 0.018***5 SO1 0.9 24.7 −107.3* 24 −181 0.075*** 6 CMOS 0.9 25.6 −102.5 5.5 −1830.067 7 CMOS 1.0 27.3 −105.7 11.6 −184 0.064 VCO1100A CMOS 0.8 27.5−108.1 4 −191 0.011

As illustrated in Table 1, the non-limiting example of VCO 1100Aprovides a relatively low-power, small-area approach having at leastequivalent performance parameters compared to the other approachesconsidered.

FIGS. 12A and 12B are schematic diagrams of respective VCO circuits1200A and 1200B, in accordance with some embodiments. VCO circuit 1200A,equivalent to a portion of VCO 1100A or VCO 1100B, and VCO circuit1200B, an alternative representation of VCO circuit 1200A, depictequivalent circuits that illustrate operation of VCOs 1100A and 1100B,as discussed below.

VCO circuit 1200A includes transformer T1 including windings W1 and W2,transformer T2 including windings W3 and W4, capacitive devices C3-C6,and nodes 120 and 124-140, each discussed above with respect to FIGS.1A, 1B, 11A, and 11B, and coupling devices CD1 and CD2, discussed abovewith respect to FIGS. 11A and 11B. In the embodiment depicted in FIG.12A, coupling device CD1 is coupled between nodes 134 and 138, couplingdevice CD2 is coupled between nodes 136 and 140, and VCO circuit 1200Athereby corresponds to a portion of VCO 1100B. In some embodiments,coupling device CD1 is coupled between nodes 134 and 136, couplingdevice CD2 is coupled between nodes 138 and 140, and VCO circuit 1200Athereby corresponds to a portion of VCO 1100A.

FIG. 12A depicts a DC biasing of VCO circuit 1200A, in operation, inwhich voltage source V_(G) is applied between windings W2 and W3, powersupply source VDD is applied between windings W1 and W4, control voltageV_(ctrl1) is applied at node 120, and control voltage V_(ctrl2) isapplied at node 132. For AC signals (not shown) generated in response tothe applied voltages, the applied voltages can be collectivelyconsidered as a virtual ground, also referred to as an AC ground in someembodiments.

By the configuration discussed above, in operation, the AC signalsrelative to virtual ground have a positive 180° phase shift at node 128and a negative 180° phase shift at node 126 relative to a phase of zeroat each of nodes 124 and 130. Because node 128 is coupled to the gate oftransistor M1 depicted in FIGS. 1A, 1B, 11A, and 11B, node 126 iscoupled to the drain terminal of transistor M2 depicted in FIGS. 1A, 1B,11A, node 124 is coupled to the drain terminal of transistor M1, andnode 130 is coupled to the gate of transistor M2, in operation, each oftransistors M1 and M2 experiences a 180° phase shift such that each ofVCOs 100, 110, 1100A, and 1100B, including transistors M1 and M2configured as discussed above, oscillates in response to the appliedvoltages.

FIG. 12B depicts VCO circuit 1200B equivalent to portions of VCO circuit1200A corresponding to each of transistors T1 and T2, and therebyillustrates an equivalent AC circuit for each relevant portion. Asdepicted in FIG. 12B, each of voltage source V_(G), power supply sourceVDD, and control voltages V_(ctrl1) and V_(ctrl2) is represented as boththe applied voltage and as virtual ground of the equivalent AC circuit.

In the case of transformer T1, capacitive device C5 is coupled betweennode 128 and virtual ground, winding W2 is coupled between node 138 andvirtual ground, winding W1 is coupled between node 134 and virtualground, capacitive device C6 is coupled between node 124 and virtualground, and coupling device CD1 is coupled between nodes 134 and 138. Inoperation, the gate of transistor M1 coupled to node 128 and the drainterminal of transistor M1 coupled to node 124 are thereby controlledbased on the configuration of transformer T1.

In the case of transformer T2, capacitive device C4 is coupled betweennode 130 and virtual ground, winding W3 is coupled between node 136 andvirtual ground, winding W4 is coupled between node 140 and virtualground, capacitive device C3 is coupled between node 126 and virtualground, and coupling device CD2 is coupled between nodes 136 and 140. Inoperation, the gate of transistor M2 coupled to node 130 and the drainterminal of transistor M2 coupled to node 126 are thereby controlledbased on the configuration of transformer T2.

FIGS. 13A-13E are schematic diagrams of feedback oscillators, inaccordance with some embodiments FIG. 13A is a block diagram of afeedback oscillator 1300, referred to as a single-end feedbackoscillator 1300 in some embodiments. FIGS. 13B-13E are diagrams ofrespective feedback oscillators 1300B-1300E that are non-limitingexamples of feedback oscillator 1300 in accordance with variousembodiments.

As depicted in FIG. 13A, feedback oscillator 1300 includes a forwardstage 1310 and a feedback network 1320, each coupled to an output nodeOUT. Forward stage 1310 and feedback network 1320 are arranged in across-coupled configuration, feedback network 1320 thereby beingconfigured to provide positive feedback to forward stage 1310.

Two or more circuit elements are considered to be coupled based on adirect electrical connection or an electrical connection that includesone or more additional circuit elements, e.g., one or more logic ortransmission gates, and is thereby capable of being controlled, e.g.,made resistive or open by a transistor or other switching device.

In various embodiments, feedback oscillator 1300 includes one or morenodes (not shown in FIG. 13A) configured to have one or morecorresponding voltages, e.g., a node N1 configured to have a voltage V1,a node N2 configured to have a voltage V2, and a reference node NRconfigured to have a reference voltage VR, as variously depicted inFIGS. 13B-13E.

In the embodiments depicted in FIGS. 13A-13E, reference voltage VR is aground voltage having a ground voltage value, voltage V2 is a powersupply voltage, e.g., a voltage corresponding to power supply source VDDdiscussed above with respect to FIGS. 1A and 1B, and voltage V1 is asupply voltage having a supply voltage value between the ground voltagevalue and a power supply voltage value of voltage V2. In variousembodiments, reference voltage VR and voltages V1 and V2 have valuesother than those corresponding to FIGS. 13A-13E. For example, in someembodiments, reference voltage VR has the power supply voltage value,voltage V2 has the ground voltage value, and voltage V1 has a valuebetween the supply voltage value and the ground voltage value.

In various embodiments, forward stage 1310 includes an amplifier, e.g.,an operational amplifier, and/or a transistor, e.g., an NMOS or PMOStransistor or a BJT. Feedback network 1320 includes atransformer-coupled BPF, e.g., a transformer-coupled BPF 1320B-1320Edepicted in a corresponding one of FIGS. 13B-13E and discussed below. Byincluding the transformer-coupled BPF in feedback network 1320,oscillator 1300, e.g., one of oscillators 1300B-1300E, is configured togenerate an AC output signal VOUT on output terminal OUT, output signalVOUT having a fast roll-off characteristic, i.e., one or moretransmission zeroes, capable of suppressing high-order harmonics asfurther discussed below.

In the non-limiting examples depicted in FIGS. 13B-13E, eachcorresponding feedback oscillator 1300B-1300E includes a respectiveforward stage 1310B-1310E usable as forward stage 1310. Each forwardstage 1310B-1310E includes a terminal A1 coupled to output terminal OUT,terminals A2 and A3, and a transistor M5 coupled between terminals A1-A3in accordance with the various embodiments discussed below. In theembodiments depicted in FIGS. 13B-13E, transistor M5 is an NMOStransistor. In various embodiments, one or more of forward stages1310B-1310E includes transistor M5 being a transistor other than an NMOStransistor, e.g., a PMOS transistor, an NPN BJT, or a PNP BJT. Invarious embodiments, one or more of forward stages 1310B-1310E includesone or more transistors (not shown), in addition to transistor M5,coupled between one or more of terminals A1-A3 and one or more of adrain or source terminal or gate of transistor M5.

Each transformer-coupled BPF 1320B-1320E included in the correspondingfeedback oscillator 1300B-1300E includes terminals F1-F4, one or both oftaps PT or ST, a transformer T3 coupled between terminals F1-F4 and tapsPT and/or ST as discussed below, and a coupling device CD coupledbetween terminals F1 and F2. In various embodiments, one or more oftransformer-coupled BPFs 1320B-1320E includes one or more transistors(not shown) coupled between transformer T3 and one or more of terminalsF1-F4 and/or taps PT and/or ST. In each of the embodiments depicted inFIGS. 13B-13E, each of terminals F3 and F4 is coupled to reference nodeNR.

Transformer T3 corresponds to one of transformers 1500T-1800T depictedin FIGS. 15A-18B, and is represented collectively in the depictions ofFIGS. 19A-21B discussed below. Transformer T3 includes a primary windingW5 coupled to a secondary winding W6. Winding W5 is coupled betweenterminals F1 and F3, and winding W6 is coupled between terminals F2 andF4. In various embodiments, transformer T3 includes one or both of tapPT electrically connected to winding W5 or tap ST electrically connectedto winding W6. In various embodiments, tap PT is a center tap of windingW5 and/or tap ST is a center tap of winding W6.

Feedback oscillator 1300B depicted in FIG. 13B, also referred to as acommon-source feedback oscillator 1300B or a single-end common-sourcefeedback oscillator 1300B in some embodiments, includes forward stage1310B usable as forward stage 1310, transformer-coupled BPF 1320B usableas feedback network 1320, node N1, node N2, reference node NR, andoutput terminal OUT, each discussed above with respect to feedbackoscillator 1300 and FIG. 13A.

As depicted in FIG. 13B, forward stage 1310B includes transistor M5including a drain terminal coupled to terminal A1, a source terminalcoupled to terminal A2, and a gate coupled to terminal A3. Terminal A2is coupled to reference node NR, and terminal A3 is coupled to terminalF1 of transformer-coupled BPF 1320B. Transformer-coupled BPF 1320B alsoincludes terminal F2 coupled to terminal A1 and output terminal OUT,coupling device CD coupled between terminals F1 and F2, and transformerT3 including tap PT coupled to node N1 and tap ST coupled to node N2,thereby having a configuration corresponding to that oftransformer-coupled BPF 1700 discussed below with respect to FIGS. 17Aand 17B.

By including forward stage 1310B and transformer-coupled BPF 1320B asdepicted in FIG. 13B, feedback oscillator 1300B is configured togenerate output signal VOUT on output terminal OUT having the benefitsdiscussed above with respect to feedback oscillator 1300.

Feedback oscillator 1300C depicted in FIG. 13C, also referred to as acommon-gate feedback oscillator 1300C or a single-end common-gatefeedback oscillator 1300C in some embodiments, includes forward stage1310C usable as forward stage 1310, transformer-coupled BPF 1320C usableas feedback network 1320, node N1, node N2, reference node NR, andoutput terminal OUT, each discussed above with respect to feedbackoscillator 1300 and FIG. 13A.

As depicted in FIG. 13C, forward stage 1310C includes transistor M5including the source terminal coupled to terminal A1, the gate coupledto terminal A2, and the drain terminal coupled to terminal A3. TerminalA2 is coupled to node N1, and terminal A3 is coupled to terminal F1 oftransformer-coupled BPF 1320C. Transformer-coupled BPF 1320C alsoincludes terminal F2 coupled to terminal A1 and output terminal OUT,coupling device CD coupled between terminals F1 and F2, and transformerT3 including tap PT coupled to node N2, thereby having a configurationcorresponding to that of transformer-coupled BPF 1500 discussed belowwith respect to FIGS. 15A and 15B.

By including forward stage 1310C and transformer-coupled BPF 1320C asdepicted in FIG. 13C, feedback oscillator 1300C is configured togenerate output signal VOUT on output terminal OUT having the benefitsdiscussed above with respect to feedback oscillator 1300.

Feedback oscillator 1300D depicted in FIG. 13D, also referred to as acommon-gate feedback oscillator 1300D or a single-end common-gatefeedback oscillator 1300D in some embodiments, includes forward stage1310D usable as forward stage 1310, transformer-coupled BPF 1320D usableas feedback network 1320, node N1, node N2, reference node NR, andoutput terminal OUT, each discussed above with respect to feedbackoscillator 1300 and FIG. 13A.

As depicted in FIG. 13D, forward stage 1310D includes transistor M5including the drain terminal coupled to terminal A1, the gate coupled toterminal A2, and the source terminal coupled to terminal A3. Terminal A2is coupled to node N1, and terminal A3 is coupled to terminal F1 oftransformer-coupled BPF 1320D. Transformer-coupled BPF 1320D alsoincludes terminal F2 coupled to terminal A1 and output terminal OUT,coupling device CD coupled between terminals F1 and F2, and transformerT3 including tap ST coupled to node N2, thereby having a configurationcorresponding to that of transformer-coupled BPF 1600 discussed belowwith respect to FIGS. 16A and 16B.

By including forward stage 1310D and transformer-coupled BPF 1320D asdepicted in FIG. 13D, feedback oscillator 1300D is configured togenerate output signal VOUT on output terminal OUT having the benefitsdiscussed above with respect to feedback oscillator 1300.

Feedback oscillator 1300E depicted in FIG. 13E, also referred to as acommon-drain feedback oscillator 1300E or a single-end common-drainfeedback oscillator 1300E in some embodiments, includes forward stage1310E usable as forward stage 1310, transformer-coupled BPF 1320E usableas feedback network 1320, node N1, node N2, reference node NR, andoutput terminal OUT, each discussed above with respect to feedbackoscillator 1300 and FIG. 13A.

As depicted in FIG. 13E, forward stage 1310E includes transistor M5including the source terminal coupled to terminal A1, the drain terminalcoupled to terminal A2, and the gate coupled to terminal A3. Terminal A2is coupled to node N2, and terminal A3 is coupled to terminal F2 oftransformer-coupled BPF 1320E. Transformer-coupled BPF 1320E alsoincludes terminal F1 coupled to terminal A1 and output terminal OUT,coupling device CD coupled between terminals F1 and F2, and transformerT3 including tap ST coupled to node N1, thereby having a configurationcorresponding to that of transformer-coupled BPF 1600 discussed belowwith respect to FIGS. 16A and 16B.

By including forward stage 1310E and transformer-coupled BPF 1320E asdepicted in FIG. 13E, feedback oscillator 1300E is configured togenerate output signal VOUT on output terminal OUT having the benefitsdiscussed above with respect to feedback oscillator 1300.

FIGS. 14A and 14B are schematic diagrams of differential oscillators, inaccordance with some embodiments FIG. 14A is a block diagram of afeedback oscillator 1400, and FIG. 14B is a diagram of a differentialoscillator 1400B, a non-limiting example of feedback oscillator 1400 inaccordance with some embodiments.

As depicted in FIG. 14A, differential oscillator 1400 includes atransformer-coupled BPF 1420 and a differential circuit 1430.Transformer-coupled BPF 1420 is coupled to node NR, discussed above withrespect to FIGS. 13A-13E, and each of transformer-coupled BPF 1420 anddifferential circuit 1430 is coupled between output nodes OUTP and OUTN.Transformer-coupled BPF 1420 and differential circuit 1430 are arrangedin a parallel configuration, differential oscillator 1400 thereby beingconfigured to generate a differential output signal as complementarysignals VOUTP on output node OUTP and VOUTN on output node OUTN.

Transformer-coupled BPF 1420 includes transformer T3 including windingsW5 and W6, coupling device CD, and terminals F1-F4, configured asdiscussed above with respect to transformer-coupled BPFs 1320B-1320E andFIGS. 13B-13E. Compared to transformer-coupled BPFs 1320B-1320E,transformer-coupled BPF 1420 does not include either of taps PT or ST inthe embodiment depicted in FIGS. 14A and 14B and thereby has aconfiguration corresponding to that of transformer-coupled BPF 1800discussed below with respect to FIGS. 18A and 18B. In variousembodiments, transformer-coupled BPF 1420 includes one or both of tapsPT or ST coupled to one or both of nodes N1 or N2 discussed above withrespect to FIGS. 13A-13E, thereby having a configuration correspondingto that of one of transformer-coupled BPFs 1500-1700 discussed belowwith respect to FIGS. 15A-17B.

Differential circuit 1430 is an electronic circuit configured to drivesignals VOUTP and VOUTN responsive to loading at respective output nodesOUTP and OUTN provided by transformer-coupled BPF 1420. In variousembodiments, differential circuit 1430 includes one or more amplifiers,e.g., an operational amplifier, and/or transistors, e.g., an NMOS orPMOS transistor or a BJT, and one or more nodes configured to carry oneor more of a power supply or reference voltage, e.g., VDD and/or aground voltage. In various embodiments, differential circuit 1430includes a cross-coupled configuration of one or more amplifiers and/ortransistors and is thereby configured to generate signals VOUTP andVOUTN as complementary signals.

By including transformer-coupled BPF 1420 and differential circuit 1430configured as discussed above, differential oscillator 1400 is capableof generating signals VOUTP and VOUTN as the differential output signal,controlled by transformer-coupled BPF 1420 in operation, such that thedifferential output signal has a fast roll-off characteristic, i.e., oneor more transmission zeroes, capable of suppressing high-order harmonicsas discussed above with respect to VCOs 1100A and 1100B and feedbackoscillators 1300-1300E.

In the non-limiting example depicted in FIG. 14B, differentialoscillator 1400B includes a differential circuit 1430B usable asdifferential circuit 1430. Differential circuit 1430B includes atransistor M6 cross-coupled with a transistor M7 between output nodesOUTP and OUTN. In the embodiment depicted in FIG. 14B, each oftransistors M6 and M7 is a PMOS transistor and includes a sourceterminal coupled to node N1. In various embodiments, differentialcircuit 1430B includes transistors M6 and M7 being transistors otherthan PMOS transistors, e.g., NMOS transistors or NPN or PNP BJTs, andthat include one or more terminals otherwise coupled to one or more ofoutput nodes OUTP or OUTN or nodes N1, N2, or NR. In variousembodiments, differential circuit 1430B includes one or more transistors(not shown), in addition to transistors M6 and M7, coupled between oneor more terminals of transistors M6 and/or M7 and one or more of outputnodes OUTP or OUTN or nodes N1, N2, or NR.

By including differential circuit 1430B and transformer-coupled BPF 1420as depicted in FIG. 14B, differential oscillator 1400B is configured togenerate signals VOUTP and VOUTN on respective output terminals OUTP andOUTN having the benefits discussed above with respect to differentialoscillator 1400.

FIGS. 15A-18B are schematic diagrams of respective transformer-coupledBPFs 1500-1800, in accordance with some embodiments. FIGS. 15A-18Adepict circuit diagrams and FIGS. 15B-18B depict layout diagrams ofrespective transformer-coupled BPFs 1500-1800. In accordance withvarious embodiments, transformer-coupled BPFs 1500-1800 are usable astransformer-coupled BPFs 1320B-1320E or 1420, discussed above withrespect to FIGS. 13A-14B.

As depicted in FIGS. 15A-18B, transformer-coupled BPFs 1500-1800 includerespective transformers 1500T-1800T and coupling device CD discussedabove with respect to FIGS. 13A-14B. Each of transformers 1500T-1800T isan embodiment of transformer T3 discussed above with respect to FIGS.13A-14B and further discussed below.

Each of FIGS. 15A-18A depicts transformers 1500T-1800T includingterminals F1-F4, winding W5 coupled between terminals F1 and F3, andwinding W6 coupled between terminals F2 and F4, and coupling device CDcoupled between terminals F1 and F2. As depicted in FIG. 15A,transformer 1500T also includes tap PT electrically connected to windingW5. As depicted in FIG. 16A, transformer 1600T also includes tap STelectrically connected to winding W6. As depicted in FIG. 17A,transformer 1700T also includes tap PT electrically connected to windingW5 and tap ST electrically connected to winding W6.

Each of the layout diagrams depicted in FIGS. 15B-18B includes terminalsF1-F4 and, if present, taps PT and/or ST. Terminals F1-F4 and taps PTand ST correspond to respective terminals 428, 426, 420, 422, 424, and434 of coupled-transformer 400 and transformer-coupled BPFs 500-700discussed above with respect to FIGS. 4-7.

Winding W5 (not labeled in FIGS. 15B-18B) corresponds to the conductivepath between terminals F1/428 and F3/420, depicted as conductivestructures 414, 412, and 406 and discussed above with respect to FIG. 4.Winding W6 (not labeled in FIGS. 15B-18B) corresponds to the conductivepath between terminals F2/426 and F4/422, depicted as conductivestructure 418 including extending portions 438 and discussed above withrespect to FIG. 4.

As depicted in FIGS. 15B and 17B, tap PT/424 of respective transformers1500T and 1700T is electrically connected to winding W5 at a locationmidway along the conductive path between terminals F1/428 and F3/420 andcorresponding to conductive structure 412 of FIG. 4, and is therebyconfigured as a center tap of winding W5. In various embodiments, tap PTis electrically connected to winding W5 at a location other than midwayalong the conductive path between terminals F1/428 and F3/420 and isthereby configured as a tap other than a center tap of winding W5.

As depicted in FIGS. 16B and 17B, tap ST/434 of respective transformers1600T and 1700T is electrically connected to winding W6 at a locationmidway along the conductive path between terminals F2/426 and F4/422 andcorresponding to conductive structure 418 of FIG. 4, and is therebyconfigured as a center tap of winding W6. In various embodiments, tap STis electrically connected to winding W6 at a location other than midwayalong the conductive path between terminals F2/426 and F4/422 and isthereby configured as a tap other than a center tap of winding W6.

By the configurations discussed above, each of transformer-coupled BPFs1500-1800, used in an oscillator, e.g., one of feedback oscillators1300-1300E or differential oscillators 1400 or 1400B, is capable ofrealizing the benefits discussed above with respect to feedbackoscillators 1300-1300E and differential oscillators 1400 and 1400B.

FIGS. 19A-21B are schematic diagrams of respective transformer-coupledBPFs 1900-2100, in accordance with some embodiments. FIGS. 19A-21Adepict circuit diagrams and FIGS. 19B-21B depict layout diagrams ofrespective transformer-coupled BPFs 1900-2100. In accordance withvarious embodiments, transformer-coupled BPFs 1900-2100 are usable astransformer-coupled BPFs 1320B-1320E or 1420, discussed above withrespect to FIGS. 13A-14B.

As depicted in FIGS. 19A-21B, transformer-coupled BPFs 1900-2100 includetransformer T3 and respective coupling devices 1900CD-2100CD.Transformer T3 is represented in FIGS. 19A-21B as optionally includingvarious elements of the embodiments depicted in FIGS. 15A-18B asrespective transformers 1500T-1800T, and each transformer-coupled BPF1900-2100 is capable of being realized by including any one oftransformers 1500T-1800T.

In various embodiments, one or more of transformer-coupled BPFs1900-2100 includes a transformer other than transformer T3, e.g.,transformer T1 or T2 discussed above with respect to FIGS. 1A-12B, andrespective coupling devices 1900CD-2100CD. In various embodiments,coupling devices 1900CD-2100CD are usable as coupling devices CD1 andCD2 discussed above with respect to FIGS. 11A-12B and coupling device CDdiscussed above with respect to FIGS. 13A-18B.

In the embodiment depicted in FIGS. 19A and 19B, coupling device 1900CDof transformer-coupled BPF 1900 includes a capacitive device Ccconfigured in parallel with an inductive device L3. In the embodimentdepicted in FIGS. 20A and 20B, coupling device 2000CD oftransformer-coupled BPF 2000 includes capacitive device Cc configured inseries with inductive device L3. In the embodiment depicted in FIGS. 21Aand 21B, coupling device 2100CD of transformer-coupled BPF 2100 includesa capacitive device Cc3 configured in parallel with a series combinationof inductive device L3 and a capacitive device Cc4.

A capacitive device, e.g., capacitive device Cc, Cc3, or Cc4, is an ICstructure configured to provide a targeted capacitance value between twoor more terminals. In various embodiments, a capacitive device includesa plate capacitor, e.g., a MIM capacitor, a capacitor-configured MOSdevice, a variable capacitor, an adjustable capacitor, e.g., a MOSCAP,or another IC device suitable for providing a targeted capacitancevalue.

An inductive device, e.g., inductive device L3, is an IC structureconfigured to provide a targeted inductance value between two or moreterminals. In various embodiments, an inductive device includes a singleor multi-layer structure including one or more conductive, e.g.,metallic, segments, having a geometry suitable for providing a targetedinductance value. In the embodiment depicted in FIGS. 19B-21B, inductivedevice L3 includes conductive segments having an octagonal shape, and isthereby configured to provide a targeted inductance value. In variousembodiments, an inductive device includes conductive segments havinganother shape, e.g., a square, spiral or other suitable shape, and/orincludes a transmission line, and is thereby configured to provide atargeted inductance value.

By including a transformer-coupled BPF including at least one couplingdevice, e.g., a transformer-coupled BPF 1500-2100 depicted in FIGS.15A-21B, an oscillator, e.g., a feedback oscillator 1300-1300E ordifferential oscillator 1400 or 1400B, is capable of including atransmission zero configured to enhance 2nd and 3rd harmonicsuppression, thereby improving a signal to noise ratio of a generatedsignal compared to other approaches. In embodiments in which a couplingdevice includes a variable capacitor, the oscillator is further capableof including the transmission zero as a tunable transition zero. Inembodiments that include an inductive device and/or second couplingcapacitor, the oscillator is further capable of including one or moreadditional transmission zeroes, thereby further improving the signal tonoise ratio of the generated signal compared to other approaches.

FIG. 22 is a flowchart of a method 2200 of generating an oscillationsignal, in accordance with some embodiments. Method 2200 is usable withan oscillator, e.g., VCO 1100A or 1100B, feedback oscillator 1300-1300E,or differential oscillator 1400 or 1400B, discussed above with respectto FIGS. 11A, 11B, and 13A-14B, and/or with a transformer-coupled BPF,e.g., transformer-coupled BPF 1500-2100 discussed above with respect toFIGS. 15A-21B.

The sequence in which the operations of method 2200 are depicted in FIG.22 is for illustration only; the operations of method 2200 are capableof being executed in sequences that differ from that depicted in FIG.22. In some embodiments, operations in addition to those depicted inFIG. 22 are performed before, between, during, and/or after theoperations depicted in FIG. 22. In some embodiments, some or all of theoperations of method 2200 are part of operating a circuit including anoscillator, e.g., a PLL including a VCO.

At operation 2210, in some embodiments, a DC voltage is received by atransformer-coupled BPF of an oscillator. Receiving the DC voltageincludes receiving one or more of a power supply voltage, a biasvoltage, a reference voltage, e.g., a ground voltage, or a logical stateof a control or enable signal. In various embodiments, receiving the DCvoltage by the transformer-coupled BPF includes receiving the voltagefrom the oscillator of from a circuit other than the oscillator.

In some embodiments, receiving the voltage by the transformer-coupledBPF includes receiving one or more of voltage source V_(G) or powersupply source VDD discussed above with respect to FIGS. 11A and 11B, orvoltages V1 or V2 or reference voltage VR discussed above with respectto FIGS. 13A-14B.

In some embodiments, receiving the voltage by the transformer-coupledBPF of an oscillator includes receiving the voltage by one or more oftransformer-coupled BPFs 1500-2100 discussed above with respect to FIGS.15A-21B.

In some embodiments, receiving the voltage by the transformer-coupledBPF of an oscillator includes receiving the voltage by one or more oftransformer-coupled BPFs 1106 or 1112 of VCOs 1100A or 1100B discussedabove with respect to FIGS. 11A and 11B, transformer-coupled BPFs1320-1320E of feedback oscillators 1300-1300E discussed above withrespect to FIGS. 13-13E, or transformer-coupled BPF 1420 of differentialoscillators 1400 or 1400B discussed above with respect to FIGS. 14A and14B.

In some embodiments, receiving the voltage by the transformer-coupledBPF of an oscillator includes receiving one or more additional voltagesby one or more components of the oscillator in addition thetransformer-coupled BPF. In some embodiments, receiving the voltage bythe transformer-coupled BPF of an oscillator includes receiving one ormore of voltage power source V_(BUF), or control voltages V_(ctrl1) orV_(ctrl2) by resonator 1102 of VCOs 1100A or 1100B discussed above withrespect to FIGS. 11A and 11B. In some embodiments, receiving the voltageby the transformer-coupled BPF of an oscillator includes receiving oneor more of voltages V1 or V2 or reference voltage VR by one or more offorward stage 1310-1310E or differential circuit 1430 or 1430B discussedabove with respect to FIGS. 13A-14B.

At operation 2220, in response to the applied DC voltage, the oscillatorgenerates an oscillation signal. Generating the oscillation signalincludes generating the oscillation signal using the transformer-coupledBPF of the oscillator. In various embodiments, generating theoscillation signal includes generating the oscillation signal using oneor more of transformer-coupled BPFs 1500-2100 discussed above withrespect to FIGS. 15A-21B.

In various embodiments, generating the oscillation signal includesgenerating a complementary pair of signals or a standalone signal. Invarious embodiments, generating the oscillation signal includes theoscillator generating the oscillation signal at a pair of outputterminals of the oscillator or at a single output terminal of theoscillator.

In some embodiments, generating the oscillation signal includes usingtransformer-coupled BPF 1106 or 1112 to control the drain terminals oftransistors M1 and M2 of VCO 1100A or 1100B as discussed above withrespect to FIGS. 11A-12B. In some embodiments, generating theoscillation signal includes generating signal VOUT at output terminalOUT as discussed above with respect to FIGS. 13A-13E. In someembodiments, generating the oscillation signal includes generatingsignals VOUTN at output terminal OUTN and VOUTP at output terminal OUTPas discussed above with respect to FIGS. 14A and 14B.

By executing some or all of the operations of method 2200, an oscillatorgenerates an oscillation signal having enhanced 2nd and 3rd harmonicsuppression compared to other approaches, thereby obtaining the benefitsdiscussed above with respect to VCOs 1100A and 1100B, feedbackoscillators 1300-1300E, differential oscillators 1400 and 1400B, andtransformer-coupled BPFs 1500-2100.

In some embodiments, a differential oscillator includes: a differentialcircuit coupled between a first output node and a second output node;and a transformer-coupled BPF coupled between the first output node andthe second output node, the transformer-coupled BPF includes: a couplingdevice coupled between the first output node and the second output node;and a transformer includes: a first winding coupled between the firstoutput node and a voltage node; and a second winding coupled between thesecond output node and the voltage node. In some embodiments, thevoltage node is configured to have a ground voltage. In someembodiments, the differential circuit includes a cross-coupled pair oftransistors. In some embodiments, the coupling device includes acapacitive device coupled between the first output node and the secondoutput node. In some embodiments, the coupling device includes aninductive device coupled in series or in parallel with the capacitivedevice between the first output node and the second output node. In someembodiments, the transformer-coupled BPF and the differential circuitare arranged in a parallel configuration. In some embodiments, thedifferential circuit is configured to generate a differential outputsignal between the first output node and the second output node

In some embodiments, a differential oscillator includes: a differentialcircuit comprising: a first transistor having a first gate connected toa first output node; and a second transistor having a second gateconnected to a second output node; and a transformer-coupled BPF coupledbetween the first output node and the second output node, thetransformer-coupled BPF includes: a coupling device coupled between thefirst output node and the second output node; and a transformerincludes: a first winding coupled between the first output node and avoltage node; and a second winding coupled between the second outputnode and the voltage node. In some embodiments, the voltage node isconfigured to have a ground voltage. In some embodiments, the couplingdevice includes a capacitive device coupled between the first outputnode and the second output node. In some embodiments, the couplingdevice includes an inductive device coupled in series or in parallelwith the capacitive device between the first output node and the secondoutput node. In some embodiments, the transformer-coupled BPF and thedifferential circuit are arranged in a parallel configuration. In someembodiments, the differential circuit is configured to generate adifferential output signal between the first output node and the secondoutput node

In some embodiments, a differential oscillator includes: a differentialcircuit coupled between a first output node and a second output node;and a transformer-coupled BPF coupled between the first output node andthe second output node, the transformer-coupled BPF includes: atransformer including: a first winding coupled between the first outputnode and a voltage node; and a second winding coupled between the secondoutput node and the voltage node; and a coupling device coupled betweenthe first output node and the second output node, wherein the couplingdevice comprises a third winding and a first capacitor connected inseries. In some embodiments, the coupling device further comprises asecond capacitor connected in parallel with the third winding and thefirst capacitor. In some embodiments, the voltage node is configured tohave a ground voltage. In some embodiments, the differential circuitincludes a cross-coupled pair of transistors. In some embodiments, thecoupling device includes a capacitive device coupled between the firstoutput node and the second output node. In some embodiments, thecoupling device includes an inductive device coupled in series or inparallel with the capacitive device between the first output node andthe second output node. In some embodiments, the transformer-coupled BPFand the differential circuit are arranged in a parallel configuration.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A differential oscillator comprising: adifferential circuit coupled between a first output node and a secondoutput node; and a transformer-coupled band-pass filter (BPF) coupledbetween the first output node and the second output node, thetransformer-coupled BPF comprising: a coupling device coupled betweenthe first output node and the second output node; and a transformercomprising: a first winding coupled between the first output node and avoltage node; and a second winding coupled between the second outputnode and the voltage node.
 2. The differential oscillator of claim 1,wherein the voltage node is configured to have a ground voltage.
 3. Thedifferential oscillator of claim 1, wherein the differential circuitcomprises a cross-coupled pair of transistors.
 4. The differentialoscillator of claim 1, wherein the coupling device comprises acapacitive device coupled between the first output node and the secondoutput node.
 5. The differential oscillator of claim 4, wherein thecoupling device further comprises an inductive device coupled in seriesor in parallel with the capacitive device between the first output nodeand the second output node.
 6. The differential oscillator of claim 1,wherein the transformer-coupled BPF and the differential circuit arearranged in a parallel configuration.
 7. The differential oscillator ofclaim 1, wherein the differential circuit is configured to generate adifferential output signal between the first output node and the secondoutput node.
 8. A differential oscillator comprising: a differentialcircuit comprising: a first transistor having a first gate connected toa first output node; and a second transistor having a second gateconnected to a second output node; and a transformer-coupled band-passfilter (BPF) coupled between the first output node and the second outputnode, the transformer-coupled BPF comprising: a coupling device coupledbetween the first output node and the second output node; and atransformer comprising: a first winding coupled between the first outputnode and a voltage node; and a second winding coupled between the secondoutput node and the voltage node.
 9. The differential oscillator ofclaim 8, wherein the voltage node is configured to have a groundvoltage.
 10. The differential oscillator of claim 8, wherein thecoupling device comprises a capacitive device coupled between the firstoutput node and the second output node.
 11. The differential oscillatorof claim 10, wherein the coupling device further comprises an inductivedevice coupled in series or in parallel with the capacitive devicebetween the first output node and the second output node.
 12. Thedifferential oscillator of claim 8, wherein the transformer-coupled BPFand the differential circuit are arranged in a parallel configuration.13. The differential oscillator of claim 8, wherein the differentialcircuit is configured to generate a differential output signal betweenthe first output node and the second output node.
 14. A differentialoscillator comprising: a differential circuit coupled between a firstoutput node and a second output node; and a transformer-coupledband-pass filter (BPF) coupled between the first output node and thesecond output node, the transformer-coupled BPF comprising: atransformer comprising: a first winding coupled between the first outputnode and a voltage node; and a second winding coupled between the secondoutput node and the voltage node; and a coupling device coupled betweenthe first output node and the second output node, wherein the couplingdevice comprises a third winding and a first capacitor connected inseries.
 15. The differential oscillator of claim 14, wherein thecoupling device further comprises a second capacitor connected inparallel with the third winding and the first capacitor.
 16. Thedifferential oscillator of claim 14, wherein the voltage node isconfigured to have a ground voltage.
 17. The differential oscillator ofclaim 14, wherein the differential circuit comprises a cross-coupledpair of transistors.
 18. The differential oscillator of claim 14,wherein the coupling device comprises a capacitive device coupledbetween the first output node and the second output node.
 19. Thedifferential oscillator of claim 14, wherein the coupling device furthercomprises an inductive device coupled in series or in parallel with thecapacitive device between the first output node and the second outputnode.
 20. The differential oscillator of claim 14, wherein thetransformer-coupled BPF and the differential circuit are arranged in aparallel configuration.